Merak is Afilm's proprietary advanced transfer platform, featuring a compact footprint and high throughput. It can be configured with a wide range of process chambers — including CFP a-Carbon, PE TEOS, PE SiH4, DARC, NF DARC, Nitride, a-Si, HDR TEOS, and LDF II — delivering diverse and advance…

The GFF (Gap-fill Film) tool is a system developed by Afilm for STI (Shallow Trench Isolation) applications at the 28nm node and below. For silicon oxide film processes, it delivers void-free gap fill at an aspect ratio of 8:1 — an industry-leading capability.

The HDR (High Deposition Rate) tool is a high-deposition-rate silicon oxide film system developed by Afilm for inter-die gap-fill oxide applications in advanced packaging. It can deposit over 30 µm of film in a single pass at temperatures of 180–280°C, with a cumulative film thickness exceeding 120…

The PLP (Panel-Level Packaging) PECVD tool is an advanced system developed by Afilm for glass substrate packaging, used for the deposition of SiO, SiN, SiON, SiCN, and SiOC:H organic–inorganic hybrid films.