2025-09-26
Afilm Semiconductor Attends IC World | Special Report Decodes New Perspectives on Atomic Level Processing
DAILY NEWS
The 2025 Beijing International Seminar on Micro-electronics and IC WORLD Conference grandly opened in Beijing on September 24th to 25th. Centered around the theme "Gathering Momentum for Chip Breakthroughs, Leading the New Era with Intelligence", the event upheld its consistent philosophy of "collaborative innovation and deep integration".It concurrently hosted high-level academic conferences and industry expos, bringing together global experts and corporate representatives in the microelectronics field to explore cutting-edge trends and breakthrough directions in the semiconductor industry.

As a rising force in the field of high-end semiconductor equipment, Jiangsu Afilm Semiconductor Technology Co., Ltd. (hereinafter referred to as "Afilm Semiconductor") was invited to participate in this conference. R&D Vice President of Afilm Semiconductor appeared at the "IC Manufacturing Development Industry Chain Forum" and delivered a keynote speech titled "Introduction to Bottom‑up Atomic‑Level Processing", offering the audience with a technical sharing rich in practical insights, covering technical principles, solutions to industry pain points, and application prospects.

During the speech, R&D Vice President of Afilm Semiconductor highlighted Area Selective Deposition (ASD) technology, which plays a key role in advanced 7nm and below process nodes as a bottom‑up advanced process:
Break through the lithography bottleneck: effectively solve the current challenge of unavoidable Edge Placement Errors (EPE) in traditional lithography, providing technological support for the continuous advancement of chip processes;
Improve industrial economic benefits: by optimizing process flows, this technology improves chip manufacturing yield while reducing production steps and lowering overall costs, thereby helping the semiconductor industry achieve cost reduction and efficiency improvement;
Among them, the AS‑ALD process, as a key component of the ALD technology system, has become one of the key technologies to support the iteration and the development of advanced semiconductor manufacturing processes due to its precise thin film deposition capability.
About Afilm
Jiangsu Afilm Semiconductor Technology Co., Ltd. was established on February 1st, 2023, which is a high‑end equipment manufacturer dedicated to the development of thin film deposition technologies, primarily engaged in the R&D, manufacturing, sales, and maintenance services of related equipment. Its business covers a wide range of pan‑semiconductor fields, including advanced front‑end processes, advanced packaging, large wafers, and advanced displays.
Currently, Afilm Semiconductor has established a series of core product portfolios, including 12‑inch PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment, 12‑inch PEALD (Plasma Enhanced Atomic Layer Deposition) equipment, 12‑inch PEALE (Plasma Enhanced Atomic Layer Etching) equipment, and the supporting Mainframe platform. These all belong to the core equipment in semiconductor manufacturing, capable of meeting the high-precision and high-stability production requirements under advanced process nodes, contributing to the autonomous and controllable domestic semiconductor industry chain.

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